| 摘要 |
PURPOSE: A semiconductor device is provided to prevent the penetration of humidity into a semiconductor chip and to enhance reliability by preventing the peering of the semiconductor chip and the disconnection of bonding wire. CONSTITUTION: The semiconductor device comprises: a circuit board which semiconductor chips are loaded by adhesive and sealed by resin; die patterns(17) for loading the semiconductor chips by using adhesive; plural connecting electrodes(19) connected to respective electrode of the semiconductor chips by bonding wire(31); wiring patterns connected to the die pattern or connecting electrodes by through-holes(13); plural pad electrodes(21) mounted on the wiring pattern; plural soldering bumps(35) connected to the wiring pattern through respective pad electrode. |
