METHOD FOR FORMING CONTACT OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A contact forming method of semiconductor device is disclosed to improve a reliability and yield of manufacturing process of semiconductor device. CONSTITUTION: The method includes changing a contact shape formed on reticle into a doughnut-shaped contact. Thereby, it is possible to reduce damages applied to a gate oxide film due to a crowding of current and a junction spiking generated during ESD(Electro Static Discharge) test. Also, a excessive reaction of Ti and Si generating when forming a large contact is suppressed, so that a junction leakage can be reduced