| 发明名称 |
Polyphenylene sulfide resin composition and resin-encapsulated semiconductor device |
| 摘要 |
<p>A polyphenylene sulfide resin composition, which comprises, in addition to a polyphenylene sulfide resin and an inorganic filler, at least one whisker selected from the group consisting of titania whisker and aluminum borate whisker.</p> |
| 申请公布号 |
SG70032(A1) |
申请公布日期 |
2000.01.25 |
| 申请号 |
SG19970003614 |
申请日期 |
1997.09.29 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HOTTA YASUYUKI;FUJIEDA SHINETSU;OKUYAMA TETSUO |
| 分类号 |
C08K3/00;C08K5/5435;C08L45/00;C08L81/02;H01L23/29;H01L23/31;(IPC1-7):C08L81/02;C08K3:22 |
主分类号 |
C08K3/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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