| 摘要 |
<p>PURPOSE: A semiconductor package is provided to eliminate trim and forming processes. CONSTITUTION: The semiconductor package comprises a semiconductor chip(21), a lead(12), a bump(22) and a bag material(23). Bond pads are prepared on the semiconductor chip(21). The lead(12) is composed of an inner lead portion(12a) and out lead portion(12b). The inner lead portion(12a) is attached to the upper portion of the semiconductor chip(21) by a bond tape(11). The out lead portion(12b) is down set from the inner lead portion(12a), and is extended to outer direction of the semiconductor chip(21). The bump(22) electrically connects the bond pad to side of the inner lead portion(12a). The bag material(23) envelops the upper portion of semiconductor chip(21) and inner lead portion(12a).</p> |
