| 摘要 |
PURPOSE: A method is provided to remove an inherent stress of a deposited film. CONSTITUTION: A wafer surface is fixed to a wafer chuck having a curved surface. When a surface of the chuck has a convex shape, a tension stress is forced into a deposited film. If removed from the chuck, the deposited film generates a compressive stress. When a surface of the chuck has a concave shape, a compressive stress is forced into the deposited film. If removed from the chuck, the deposited film generates the tension stress. If the compressive stress is forced to the film, providing a thermal stabilization to the film of an inherent tension stress is helpful. Also, a stress load improves a contact characteristic between films, and a bending of a film is prevented at annealing.
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