发明名称 THIN FILM FORMATION ON FILM SUBSTRATE USING NORMAL PRESSURE PLASMA
摘要 PROBLEM TO BE SOLVED: To inhibit generation of wrinkles on a substrate film when continuously forming a thin film on the surface of a film substrate having moisture- absorption characteristics such as TAC, etc., using a normal pressure plasma. SOLUTION: In this process, under a pressure around atmospheric pressure, a film substrate F is passed between counter electrodes 11, 12, a pulse voltage is applied between the counter electrodes 11, 12 to generate a discharge plasma, and a thin film is continuously formed on the surface of the film substrate F using this discharge plasma. Here, a thin film is formed by applying a pulse voltage between counter electrodes 11, 12 to yield an electric field strength of from 1 to 90 kV/cm under a gas atmosphere comprising from 0.01 to 5 vol.% metal element-containing alkoxide and from 50 to 99.99 vol.% argon gas, and the temperature of the film substrate F during film formation is controlled at 100 deg.C or lower to inhibit the fluctuation of temperature (moisture content) of the film substrate in the plasma discharge space.
申请公布号 JP2000026632(A) 申请公布日期 2000.01.25
申请号 JP19980197559 申请日期 1998.07.13
申请人 SEKISUI CHEM CO LTD 发明人 YARA TAKUYA;NISHIGUCHI NAOKI
分类号 H05H1/24;C08J7/00 主分类号 H05H1/24
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