| 摘要 |
PROBLEM TO BE SOLVED: To efficiently obtain foil whose thickness is freely controlled at high yield by forming a mask layer having a desired pattern on the surface of an electrically conductive board, electroplating the exposed surface with Au-Sn and peeling the obtd. plating layer from the electrically conductive board. SOLUTION: On the surface of an electrically conductive board 1, a mask layer 2 having a desired planar pattern is formed. By changing the planar pattern of the mask layer 2, an indentation having an optional planar shape such as a tetragon, a circle, a doughnut shape or the like is formed on the surface of the electrically conductive board 1. By changing the thickness of the mask layer 2, the depth of the indentation can suitably be set. Au and Sn are simultaneously electrodeposited on the exposed face from the indentation, and an Au-Sn plating layer 4 is formed so as to bury the indentation. From the electrically conductive board 1 after the completion of the electroplating, the Au-Sn plating layer 4 is peeled. Concretely, the pattern of the mask layer 2 is removed by etching or the like, and by slightly applying twisting or the like to the electrically conductive board 1, the Au-Sn plating layer 4 is peeled.
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