发明名称 ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a two-pack ordinary-temperature-curable adhesive composition which is reduced in the emission of an odor and in the skinning of the surface of the curing agent, can be rapidly cured even when it is applied in a small amount, namely, when the coating thickness is small, and can exhibit excellent properties such as adhesive strength, elasticity, and flexibility after being cured. SOLUTION: There is provided a two-pack adhesive composition comprising agent A comprising 100 pts.wt. epoxy resin, 1-60 pts.wt. inorganic filler, and 0.01-5 pts.wt. tackifier and agent B comprising 100 pts.wt. aliphatic thiol, 0.1-20 pts.wt. cure accelerator, 1-60 pts.wt. inorganic filler, and 0.01-5 pts.wt. tackifier, wherein the mixing ratio of agent A to agent B is such that 0.5-1 pt.wt. aliphatic thioether is present per pt.wt. epoxy resin.
申请公布号 JP2000026828(A) 申请公布日期 2000.01.25
申请号 JP19980197560 申请日期 1998.07.13
申请人 SEKISUI CHEM CO LTD 发明人 SAKAMOTO MASAHIRO
分类号 C08G59/40;C09J163/00;(IPC1-7):C09J163/00 主分类号 C08G59/40
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