| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in rapid curability and moldability, capable of giving an excellent cured product having no problem in reliability, even if the composition is especially used by a non-postcuring method, and therefore capable of giving a semiconductor device sealed with the cured product and having excellent reliability. SOLUTION: This epoxy resin composition comprises an epoxy resin, a curing agent and an inorganic filler as essential components. Therein, the characteristics comprise the following requirements (A)-(C). (A) At least one of the epoxy resin and the curing agent has an average molecular weight distribution satisfying that the ratio of Mw/Mn is <=1.6, wherein Mw is the weight-average molecular weight and Mn is the number-average molecular weight, and further, has a molecular weight distribution satisfying that the amount of dinuclear units is <8 wt.% and that the total amount of heptanuclear units and larger units is <=32 wt.%. (B) The content of the inorganic filler is >=70 wt.%, based on the total amount of the composition. (C) A set of the glass transition temperatures, defined as below, has the relation of the following inequality: (Tg2-Tg1)/Tg2<0.1, wherein Tg1 is the glass transition temperature of a cured product obtained by curing the composition for 90 sec at 180 deg.C; Tg2 is the glass transition temperature of a postcured product obtained by postcuring the above cured product further for 5 hr at 180 deg.C.
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