发明名称 Bottle-shaped trench capacitor with epi buried layer
摘要 A bottle-shaped trench capacitor having an expanded lower trench portion with an epi layer therein. The epi layer serves as the buried plate of the trench capacitor. A diffusion region surrounds the expanded lower trench portion to enhance the dopant concentration of the epi layer. The diffusion region is formed by, for example, gas phase doping, plasma doping, or plasma immersion ion implantation.
申请公布号 US6018174(A) 申请公布日期 2000.01.25
申请号 US19980105580 申请日期 1998.06.26
申请人 SIEMENS AKTIENGESELLSCHAFT;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 SCHREMS, MARTIN;MANDELMAN, JACK;HOEPFNER, JOACHIM;SCHAEFER, HERBERT;STENGL, REINHARD
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/108;H01L29/94;(IPC1-7):H01L27/108;H01L29/76 主分类号 H01L27/04
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