| 摘要 |
PURPOSE: A semiconductor device is provided for an optimized harmonic impedance in a semiconductor chip regardless of: deviation of path length among semiconductor chip, internal and external matching circuits; and precision of wire length. CONSTITUTION: The device comprises: a semiconductor chip capable of amplifying in high frequency; an internal matching circuit; a harmonic matching circuit composed of capacitors and inductors in every semiconductor cell in which the circuit is disposed between the semiconductor chip and the internal matching circuit; a package for the semiconductor substrate, the semiconductor chip, the internal matching circuit and the harmonic matching circuit. |
