发明名称 TREATING METHOD OF LIQUID WATE PCB
摘要 PROBLEM TO BE SOLVED: To treat liquid waste PCB surely in safety with no anxiety of causing pollution by subjecting the liquid waste PCB to combustion decomposition under action of carbon, hydrogen and sulfur components incident to combustion of waste tire and active carbon. SOLUTION: A waste tire 30 including a metal wire is carried on a tire throw-in conveyor 31 and thrown into a tire combustion furnace 1 through a tire throw-in opening 8A. The waste tire 30 is burnt forcibly at 800-950 deg.C under presence of oxygen, CO2 and steam while supplying air by means of a combustion blower 32. Liquid PCB carrying active carbon is introduced into the tire combustion furnace 1 by an arbitrary means and subjected to combustion decomposition under action of carbon, hydrogen and sulfur components incident to combustion of waste tire and active carbon. According to the method, liquid waste PCB can be treated surely in safety without anxiety of causing pollution.
申请公布号 JP2000028124(A) 申请公布日期 2000.01.25
申请号 JP19980199081 申请日期 1998.07.14
申请人 HOKKAIDO REHABILI 发明人 OBATA TAKEJI
分类号 A62D3/38;A62D101/22;B09B3/00;F23G7/00;F23G7/12;(IPC1-7):F23G7/00;A62D3/00 主分类号 A62D3/38
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