| 摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor device to be transported without producing any curved pin and further enable a less number of semiconductor devices to be carried in a well-portable manner. SOLUTION: A plate member 4 is formed with many holes 6 in correspondence with pins of a PGA package. In the case that the PGA package is to be held, the package is mounted and held on the plate member 4 under a state in which each of the pins vertically installed at the lower surface of the PGA package is being inserted into each of the holes 6 formed in the plate member 4. Under this state, even if vibration or the like is applied to the plate member 4 during transportation, the package is scarcely moved. Further, since each of the pins is inserted into each of the holes 6 and protected, each of the pins is not curved. In addition, the plate member 4 is folded along a groove 12 and it can be easily cut. Accordingly, in the case that a less number of semiconductor devices are carried, the plate member 4 is cut to a requisite size to enable its portable characteristic to be improved.
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