SEMICONDUCTOR WAFER CHAMFERING METHOD AND DEVICE THEREFOR

摘要

PROBLEM TO BE SOLVED: To increase the effective area of a semiconductor wafer, to shorten chamfering time and to lengthen the service life of a grinding wheel by uniformizing a chamfer allowance over the whole periphery of the wafer in relatively small quantity. SOLUTION: The dislocation quantity of a adsorption-holding position of a silicon wafer actually set on a rotary table 12, from a preset silicon wafer adsorption-chamfering reference position P is fed back to XY tables 13, 14 to control the silicon wafer depth-of-cut quantity of a chamfering wheel 11. A chamfer allowance can therefore be uniformized over the whole periphery of the wafer so as to increase the effective area of the silicon wafer, to shorten chamfering time and to lengthen the grinding wheel life of the chamfering wheel 11.