MANUFACTURING APPARATUS OF PALLADIUM LAYER AND ELECTROPLATING METHOD

摘要

PURPOSE: A palladium layer manufacturing method is provided to coat the surface of the palladium useful for packaging the integrated circuit device. CONSTITUTION: The electroplating method of the palladium layer contains the steps of:providing by forming at least one material layer having the hardness less than about 250(KHN¬50) on a substrate(100); forming a palladium layer(150) having the hardness less than about 500(KNH¬50) from a palladium bath; and applying the current density of about 5 to 150Amps/ft¬2 during the adequate time period to plate the palladium layer of a specific thickness on the substrate while keeping the pH of the palladium bath at a range of about 7.0 to 8.0.