发明名称
摘要 PROBLEM TO BE SOLVED: To minimize a disposal part after setting by shortening a molding cycle by a method wherein injection molding is carried out into a mini-sprue mold by using an epoxy resin composition having latent setting characteristics. SOLUTION: An epoxy resin forming a sprue 11 and a runner 12 of a manifold part always keeps a fluid state without being set, and is not taken out together with a molded product. After taking out the molded product and a minisprue part 20, the epoxy resin is successively continuously applied to injection molding. The mini sprue part 20 is a zone wherein the epoxy resin is cured, and only the mini sprue 21 which is taken out simultaneously as a set material when a set molded product is taken out is discarded. The epoxy resin has latent type setting characteristics of at least 1,000sec gel time at 70 deg.C and at least 12,000cal/mol activation energy of the reaction.
申请公布号 JP3003101(B2) 申请公布日期 2000.01.24
申请号 JP19960135159 申请日期 1996.05.29
申请人 发明人
分类号 B29C45/73;B29C45/00;B29C45/78;B29K63/00;C08L63/00;(IPC1-7):B29C45/00 主分类号 B29C45/73
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