| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which does not cause a damage to a covering plated layer and besides is excellent in crack resistance under conditions of heat cycle or the like. SOLUTION: In a multilayer printed wiring board which has such a structure that a conductor circuit is made through an interlayer resin insulating layer on a board, that the substrate is provided with a through hole, and that the through hole is charged with a filler, a conductor layer to cover the exposed face from the through hole of filling material is made right above the through hole, and a roughened layer is made all over the surface including the side face, in the conductor circuit positioned in the same layer as this conductor layer, and an interlayer resin insulating layer which fills the recess between the conductors and whose surface is flat is made at the surface of the roughened layer. |
