| 摘要 |
PROBLEM TO BE SOLVED: To efficiently heat treat and carry a substrate to be treated for improving the throughput. SOLUTION: A cassette chamber 11 for housing cassettes and a heat treating furnace 1 for performing specified heat treatment, after lifting and carrying substrates W to be treated from a throat 3 by a liftable substrate holder 2 one by one are provided around a carrying chamber 39 having a carrying arm, a shutter chamber 5 having a heat insulation shutter 4 for thermally shielding the throat 3 to cool the substrates W lowered and carried out of the heat treating furnace 1 to a temp. low enough to carry, and a substrate cooling chamber for cooling the substrates W to a temp. sufficiently low to house in the cassette are provided, the wafers W are taken out of the cassette in the cassette chamber 5 and transferred to the substrate holder 2 in the shutter chamber 5 through the carrying arm, and the treated wafers W are taken from the substrate holder 2 and returned to the cassette through the substrate cooling chamber after the heat treatment. |
