| 摘要 |
PROBLEM TO BE SOLVED: To decrease the distortions of thermal expansion applied on a solder ball in the flip-chip mounting technology. SOLUTION: A solder ball 6 is manufactured so that the arrangement of the solder ball is shifted at the non-operating time in that the position of the solder ball 6 on the IC chip 1 in operation adapts to the position of an electrode 7 on a package substrate 8. Thus, even when the IC chip 1 is operated and expands thermally, the conductor approaches to the regular position, therefor the distortion is reduced. Reduction of lift time, possibility of breakdowns or of separation from the electrode can be avoided. |
