| 摘要 |
PROBLEM TO BE SOLVED: To prevent wiring shorting by wire sagging without degrading the wiring efficiency. SOLUTION: In the mounting structure of a printed wiring board, which connects an electronic component 3 mounted on a die-bonding pad 2 is connected to a bonding pad 4 with a gold wire 5 on the printed wiring board 1, silk printing 6 is applied between the die-bonding pad 2 and the bonding pad 4. By applying the silk printing 6, even it a pattern is wired between the die-bonding pad 2 are the bonding pad 4, the shorting between this pattern and a gold wire 5 connecting the electronic component 3 and the bonding pad 4 can be prevented, and the restriction on the wiring of the pattern is dispensed with. |
