EXPOSURE METHOD AND ALIGNER, AND MANUFACTURE OF DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the total throughput by reducing the number of exchange of a mask pattern or wasteful movements of a wafer. SOLUTION: Plural mask patterns are exchanged and transferred by multiplex exposure or switching exposure for a wafer 228 having plural regions, and at successive operating this to each wafer while exchanging those plural wafers, when the wafer (mask pattern) is exchanged, the first exposure is operated with the mask pattern used last (with respect to a shot region operated at least) before the exchange.