| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component that is made thinner and has strength improved with respect to external pressure such as atmospheric pressure. SOLUTION: This electronic component is provided with a sealed space 2c between a support substrate 1a and a lid substrate 1c, where the pressure is reduced to below atmospheric pressure. Sealed parts 8a, 9a, 11, 12 are housed in this sealed space 2c. At least one support body 13 is provided between the support substrate 1a and the lid substrate 1c in the sealed space 2c, and the two substrates support each other against the atmospheric pressure. |
