| 摘要 |
PROBLEM TO BE SOLVED: To achieve a compact configuration and thin-type configuration, without causing edge shortages between a semiconductor element and a bonding wire in the surface-mounting type semiconductor device such as a BGA package using a wire-bonding method. SOLUTION: A recess 2 is provided in the upper surface of a wiring substrate 1. A semiconductor element 6 is mounted in this recess part 2. At the same time, an inner electrode 3 is provided on the upper surface or the wiring substrate 1 other than the recess 2. The inner electrode 3 and the semiconductor element 6 in the recess 2 are connected by a bonding wire 7. Thus, the length of the wire or the height of the loop is made small. |
