| 摘要 |
PROBLEM TO BE SOLVED: To provide the method for producing a housing for housing an IC card. SOLUTION: This method includes a process of punching a pair of metal covers 16 and 20, at least one of which has a continuous edge provided with plural through-holes separated away from each other inwards along the edge 32. The metal covers 16 and 20 are placed on a mold for an injection molding process. Plastic support materials 18 and 24 are injected into the mold and fitted to the metal covers 16 and 20. Plastic material for the plastic supported material envelopes the continuous edge 32 and flows through the through-holes 34 of the metal covers. The metal covers 16 and 20 and fitted plastic support materials 18 and 24 are removed from the mold. The plastic support materials having a housing 10 formed by the metal covers, and they are bonded to each other so that it an IC card 12 can be housed. |
