| 摘要 |
PROBLEM TO BE SOLVED: To apply resist under good control of film thickness. SOLUTION: After heating and cooling a part of substrate 35 and a temperature distribution in plane thereof is made, the face of the treating substrate 35 is subjected to spin-coating with a resist. As a treatment for imparting temperature distribution, a desired region of the substrate 35 is heated, for example, by a plurality of heaters 36 put at a mounting part 31 for mounting the substrate 35. Since the resist is applied to the substrate in conditions with good temperature distribution within the plane, conversely a resist film thickness with good uniformity within the plane or a desired distribution of resist film thickness can be obtained.
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