发明名称 CREAM SOLDER COATER
摘要 PROBLEM TO BE SOLVED: To reduce the number of processes and speed up treatment, by controlling a coating part and a position adjusting mechanism on the basis of pad position information formed by CAD, and spreading cream solder on the position shown by the pad position information. SOLUTION: A position adjusting mechanism 4 consists of an XY table 4a which holds a substrate 2 and moves it in parallel in the horizontal direction, and an elevating part 4b which slides a coating part 3 in the vertical direction. The coating part 3 and the position adjusting mechanism 4 are controlled by a control part on the basis of pad position information formed by CAD, so that the plane position and the vertical position of the coating part 3 to the substrate 2 are made adjustable. Cream solder is spread on the part position shown by the pad position information adjusted in the above manner. As a result, reduction of processes and speed-up of treatment can be ensured, and working efficiency can be improved.
申请公布号 JP2000022319(A) 申请公布日期 2000.01.21
申请号 JP19980188328 申请日期 1998.07.03
申请人 HORIBA LTD 发明人 HAYAMIZU MASAAKI;UNO TOSHIHIKO
分类号 B05C5/00;B23K3/06;H05K3/34;(IPC1-7):H05K3/34 主分类号 B05C5/00
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