| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which allows development residues at solder resist opening bottoms to be surely etched off, without affecting a roughed layer on a conductor circuit surface provided for improving the adhesion to a solder resist or solder bumps and has a constitution superior in heat cycle characteristics. SOLUTION: About a printed wiring board constituted such that a solder resist layer is provided on the surface of a wiring board having a conductor circuit having a fine rough layer on the surface, exposed part of the conductor circuit through openings formed at the solder resist layer is formed as pads, and a solder-connecting metal layer is formed on the pads, the solder resist layer is a resin composite of a novolak type epoxy resin acrylate and thermoplastic resin, a layer of a metal having an ionization tendency higher than Cu but less than Ti or noble metal is formed on the rough surface layer surface, and the solder-connecting metal layer is composed of a Cu layer, Ni layer and noble metal layer laminated from the pad side.
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