发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To provide a composition excellent in a residual film ratio, resist profile, and the like to deep ultraviolet rays by containing a polymer with specific partial structure. SOLUTION: This positive photosensitive resin composition contains a compound producing acid by active light, a polymer with partial structure expressed by a formula, a nitrogen contained basic compound, and a fluorinated and/or silicone surfactant. In the formula, R1 represents methyl group or ethyl group, and R2, R3 independently represent hydroxyl group, carboxyl group, alkyl group, alkoxyl group, substitutional alkyl group, substitutional alkoxy group or cyclic alkyl group. R2 and R3 can be bonded to form a ring. X represents a bivalent organic residual group of 2-20 in the number of carbon. R4 represents hydrogen atom, alkyl group, substitutional alkyl group, cyclic alkyl group, substitutional cyclic alkyl group or a group expressed by -COOR4 and composing a group decomposed under the action of acid.</p>
申请公布号 JP2000019736(A) 申请公布日期 2000.01.21
申请号 JP19980186273 申请日期 1998.07.01
申请人 FUJI PHOTO FILM CO LTD 发明人 KAWABE YASUMASA;SATO KENICHIRO;AOSO TOSHIAKI
分类号 G03F7/004;C08L65/00;G03F7/039;H01L21/027 主分类号 G03F7/004
代理机构 代理人
主权项
地址