| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent as much as possible adhesion of a reaction product which becomes particle source and to obtain stable carrying. SOLUTION: A substrate susceptor 1 is provided with a susceptor cover 51 and is made a tapered shape. The surroundings of contact surfaces are flattened without providing other members. Thereby, the accumulation of a reaction product produced by reaction with the wafer is prevented in the vicinity of the wafer, when etching is performed. Even if the reaction product should accumulate, the adhesion of the reaction product on the wafer is restrained as much as possible by accumulating in the vicinity of an evacuation outlet provided at the lower part of a reaction chamber. Furthermore, the mechanism of the wafer 52 is disposed approximately adjacent to the edge part of the contact surfaces, and this mechanism is used only when the wafer is attached or detached so that it becomes higher than the contact surfaces of the wafer. Thus, when the wafer is attached or detached, the positional deviation of the wafer is prevented from adversely affecting the wafer.</p> |
