| 摘要 |
PROBLEM TO BE SOLVED: To save labor and space and provide an automatic process, while monitoring a film thickness with high accuracy. SOLUTION: A heat treatment unit 21, a coating unit 31, a film thickness measuring unit 28, and a carrying unit 12 at a central part are provided. By having a wafer treated sequentially at the heat treatment unit 21, the coating unit 31, the heat treatment unit 21 and the film thickness measuring unit 28, the film thickness is measured in a short time automatically with stability for monitoring the film thickness with high accuracy and good yield. In a control unit, whether or not a measured result of film thickness is within a given specified level is decided, while abnormalities in a coating apparatus can be detected on the basis of the history of former measured results stored in a memory unit. When the result is out of specifications or there is a possibility of abnormality, an alarm display or sound is generated so that reliability and stability in manufacturing is ensured. |
