APPARATUS FOR MOUNTING SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To obtain an apparatus for mounting a semiconductor which enables sealing material to be prevented from sticking to a mounting head by precisely supplying the amount of sealing material through a relatively simple method, and without using Teflon (R) tape. SOLUTION: An apparatus for mounting a semiconductor comprises a mounting head 5 in which a semiconductor device 4 is adsorbed by an adsorption hole 8 and transferred to a position where the circuit conductor layer 2 of a substrate 1 makes contact with the surface electrodes of the semiconductor device 4 and after bringing the surface electrodes into intimate contact with the circuit conductor layer 2, the application of pressure and heat allows the substrate 1 to be bonded with the semiconductor device 4. The mounting head 5 is provided with piercing holes 7 which blow air around the semiconductor device 4 in addition to the adsorption hole.