| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable soldering capable of preventing that adjacent leads are electrically connected and short-circuit is generated, by forming a fixing means capable of accommodating, fixing and taking out a PCB board on a setting plate, and installing an elevating means for elevating the setting plate in the horizontal state and the inclined state. SOLUTION: From holes 51 of a cover 52, a solder tank 50 is filled with fused solder PB, which is supplied up to a height capable of soldering a PCB P. A setting plate 2 is set on the upper surface of the cover of the solder tank 50, and a setting part is formed so as to set the PCB P. In the setting part, a fixing means which is formed on the setting plate 2 and can accommodate, fix and take out the PCB P, and elevating means which are arranged on both sides of the setting plate 2 and elevate the setting plate 2 in the horizontal state and the inclined state are installed. As a result, soldering capable of preventing that adjacent leads are electrically connected and short-circuit is generated is enabled.</p> |
