| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor chip pick-up device whose constitution is facilitated, which can have a chip speedily peel off from an adhesive sheet and can pick it up. SOLUTION: An almost cylindrical absorption cylinder (absorption means) 1 for absorbing a chip at a tip is installed by making it pass through the center part of a holder, and an air nozzle 2 spraying out high pressure air is installed on the side part of the holder. The upper end part of the absorption cylinder 1 is supported by an elevating/lowering member 11 via bearings 10 and 10, the elevating/lowering member 11 is screwed to a ball screw 12, and the absorption cylinder 1 and the air nozzle 2 are elevated/lowered as a single body with the turn of the ball screw 12. The chip stuck to the adhesive sheet is absorbed to the tip of the absorption cylinder 1 and is elevated. High pressure air is sprayed on the adhesive sheet near the corner of the chip by the air nozzle 2 from above. The absorption cylinder 1 in a state, where the chip is absorbed is elevated still further, and the chip is peeled off from the adhesive sheet.</p> |
