GUN DIODE, MANUFACTURE THEREOF, AND MOUNTING STRUCTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To improve heat dissipating performance, yield and easily mount a gun diode to a flat circuit. SOLUTION: Formation of a recess 20 in a semiconductor laminated part enables separation between a part functioning as a gun diode and a low resistance layer part functioning as a voltage application path from exterior to a first contact layer 12 of the gun diode part. Electrodes 15 and 16 for applying a voltage to the gun diode part are provided on an upper surface of a second contact layer 14.