HEATING APPARATUS FOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a heating apparatus capable of desired heat treatment for a substrate with stability in quality and without decrease in yield. SOLUTION: A heating apparatus for a substrate includes a heating plate 1 for supporting a substrate (S) and heating the substrate (S), and a baking cover 30, having a ceiling plate part 31 for covering an upper face of the heating plate 1. A heat treatment chamber 2 is composed of the heating plate 1 and the baking cover 30. At least, the ceiling part 31 of the baking cover 30 has a highly thermally conducting layer 33 with high thermal conductivity as an inner face in the heat treatment chamber 2. A thermally insulating layer 35 with a thermal conductivity lower than that of the high thermal conducting layer 33 is laminated outside the high thermal conducting layer 33.