发明名称 PACKAGE FOR HIGH-FREQUENCY
摘要 PROBLEM TO BE SOLVED: To obtain an electromagnetic coupling-type high-frequency package which is enhanced in characteristics to isolate an input line from an output line of high-frequency signals and less degraded in high frequency signal transmission characteristics. SOLUTION: A high-frequency package 1 is provided, wherein a first input line 6a, a second input line 8a, a first output line 6b, and a second output line 8b which are formed on the surface and the backside of a dielectric board 2 respectively are electromagnetically coupled through slot holes 9a and 9b having a long side of length L and provided to a grounding layer 7 located inside a dielectric board 2. The slot holes 9a and 9b are formed at positions keeping their centers separate from each other by a distance of 2L or above, and a viahole conductor 15 or a metal band is formed in regions that are each separate by at least L from the center positions z1 and z2 of the second input line 8a and the second output line 8b, respectively.
申请公布号 JP2000022042(A) 申请公布日期 2000.01.21
申请号 JP19980183938 申请日期 1998.06.30
申请人 KYOCERA CORP 发明人 KITAZAWA KENJI;KORIYAMA SHINICHI
分类号 H01L23/12;(IPC1-7):H01L23/12 主分类号 H01L23/12
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