| 摘要 |
PROBLEM TO BE SOLVED: To realize an electronic device where a heat sink can be mounted on an integrated circuit device or a board with a holding member, and a heat sink mounting operation can be easily carried out. SOLUTION: An electronic device is equipped with a board 12, an integrated circuit element 14, a heat sink 16, a rod-like clip 22 which holds the heat sink 16 to the board 12, and a spring 28 which biasses the heat sink 16 to the board 12, where the edge of the clip 22 is provided with a hook 32 composed of split hook members 32a and 32b, and the hook 32 is so structured that it can be engaged with the outer surface of the board 12 penetrating through through-holes 24 and 26 each provided to the heat sink 16 and the board 12 and can be pulled out through the through-hole 26 by making the hook members approach each other so as to be released from engagement with the outer surface of the board 12. |
