| 摘要 |
<p>PROBLEM TO BE SOLVED: To effectively etch front and rear surfaces of a wafer and effectively utilize a wafer. SOLUTION: When front and rear surfaces of a wafer are etched by using an etching jig, which has a plurality of rollers be brought into contact with the outer circumference of the wafer and comprises a plurality of grooved rollers 11 to 15, where circumferential grooves are arranged parallel in an axial direction and a drive roller, where a circumferential groove does not exist practically in an axial direction, holding the wafer by a circumferential groove of the grooved rollers 11 to 15, immersing the wafer in an etchant, together with the etching jig and rotating the wafer to the etching jig by the driving roller, an etching jig which has five or more grooved rollers 11 to 15 and where an angle between lines connecting a center of the two grooved rollers putting arbitrary one grooved roller between viewed along an outer circumferential direction of the wafer and a center of the wafer is set to be 180 deg. or less, is used as the etching jig.</p> |
