| 摘要 |
PROBLEM TO BE SOLVED: To improve mounting quality of a component on a printed board, by controlling a coating mechanism so as to spread cream solder on a pad the amount of which solder is so adjusted that a solder fillet is most suitably formed on the basis of pad position information formed by CAD. SOLUTION: In addition to pad position information which is formed by CAD and shows the positions P of pads 2a on a board 2, and connection part direction information showing the setting position of a component I to the pads 2a are recorded in a flexible disk. By using the recorded information, cream solders 4 having thicknesses of d0, d1 can be spread on the pads 2a of the board 2. That it, the cream solder 4 spread on the pad 2a in a part against which a leg Ir abuts has a thickness of d0, and the cream solders 4 spread on the pads 2a in a part against which the legs Ir do not abut has a thickness of d1. The thickness d0 is made small as compared with the thickness d1. As a result, mounting quality of a component on the board 2 can be improved.
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