发明名称 MANUFACTURE OF SEALING RESIN AND PACKAGE DEVICE THEREOF
摘要 PROBLEM TO BE SOLVED: To form a sealing resin, wherein the bubble fraction when resin packaging is performed is small. SOLUTION: Raw material is inputted from a main hopper 2 in the vicinity of the opening part of a main body 1. Kneading is performed by a pair of screws 4 comprising a shaft 4a and a spiral-shaped fin 4b. After the heating, a kneaded fused body 7 is pushed from a dies part 5. After cooling down, the fused body 7 is cut with a cutter 8, and the stick-shaped sealing resin is obtained. Since the sealing resin can be manufactured without performing the process handling powder, the manufacturing process can be shortened. Not only can the reduction of the yield rate caused by the splashing of the powder by the handling of the powder be prevented, but also a clean working environment can be provided.
申请公布号 JP2000021909(A) 申请公布日期 2000.01.21
申请号 JP19980183536 申请日期 1998.06.30
申请人 MEIDEN CHEM KK;TAMUSU TECHNOLOGY KK;NISSHO IWAI MECHATRONICS KK 发明人 JINNAI KENICHIRO;YONAHARA KUNIO;MATSUO TOMOYASU
分类号 C08G59/18;H01L21/56;(IPC1-7):H01L21/56 主分类号 C08G59/18
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