| 摘要 |
PROBLEM TO BE SOLVED: To exclude an adverse effect of screw clamping on an electronic equipment, by providing a member for transferring heat from a heat absorbing member to a heat dissipating member and an elastic member interposed between the absorbing member and the dissipating member, thereby efficiently cooling a semiconductor element. SOLUTION: A heat conduction member 10 is formed in a U shape by superposing metal foils 10a to 10f each having high thermal conductivity, its part (heat absorbing member) is brought into close contact with a surface of a package of a semiconductor element 2 via a heat conductive adhesive material 11, and an elastic member 12 is arranged in the member 10. Thus, heat generated from the element 2 is efficiently dissipated to a housing 1 via the member 10 having high heat conduction, excellent flexibility and brought into surface contact with the element 2 or the housing under a predetermined pressure. Accordingly, since screw clamping is eliminated so that an unnecessary force is not applied to a connector used in the case of fixing the element 2 to the housing, a fault such as its damage, a contact fault or the like is eliminated.
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