| 摘要 |
PROBLEM TO BE SOLVED: To conduct in a short time double exposure to the plural shot regions of a wafer. SOLUTION: Plural shot regions of a wafer 228 are exposed, while the measurement of the height of each shot region and focusing is operated by an interference fringe (image) by using a reticule for Levenson type phase shift. Then, the plural shot regions are exposed while the measurement of the height of each shot region is not exposed but focusing is made with a partially blurring circuit pattern image with the use of a reticule 223 having a pattern with line width, which is the resolution of the device or lower without developing the wafer. Thus, double exposure is conducted to plural shot regions, in a short time.
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