| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be easily and accurately positioned and mounted, and further provide a manufacturing method thereof. SOLUTION: A semiconductor device 1 is equipped with a semiconductor element 10 mounted on one surface of a board 2, ball electrodes 11 formed in an array on the other surface of the board 2, a molding resin 3 which seals up the semiconductor element 10, and positioning pins 4 provided to the other surface of the board 2 in one piece with the molding resin 3. A method of manufacturing a semiconductor device 1 comprises a process where the semiconductor element 10 is mounted on one surface of the board 2 and a process where the semiconductor element 10 is sealed up with molding resin 3 on the one surface of the board 2 and positioning pins 4 are formed on the other surface of the board 2 integrally with the molding resin 3.</p> |
