| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component device in high sealing reliability without degrading the workability of seamless welding between a ceramic package and a metallic cover. SOLUTION: In an electronic component device 1, a casing ceramic package 2 having one side open cavity part 21 containing an electronic component element 3 is covered with a metallic cover so as to seal the aperture part of the cavity part 21 by seam welding process. In such an arrangement, the metallic lid body 4 is composed of a low melting point wax material layer 4b on the package side main surface of a metallic sheet 4a as well as a metallic layer 4c in inferior wettability to said low melting point wax material layer 4b on the outer side main surface.
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