| 摘要 |
PROBLEM TO BE SOLVED: To provide the unsealing method of an IC package capable of preventing various problems for use after unsealing from being posed by a method wherein the adhesion of fragments or contamination to the inside of a ceramic package body in the case of unsealing the ceramic package is avoided without losing the convenience of a mechanical unsealing method at all. SOLUTION: A ceramic package 1 to be unsealed is coated with a coating member 8 and then after curing the coating member 8, the ceramic package 1 is loaded upside down on a supporting base 7. Next, after the level adjustment of the supporting base 7, a glass sealed part 3 is destroyed by blades 6a, 6b and then the remaining cut part of the coating member 8 is cut off by another blade 11.
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