| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component of high reliability which satisfied the specification of low resistance. SOLUTION: In an electronic component 1 containing a substrate 3 and a plurality of flat coils 52a', 52b' which are laminated on the substrate in the thickness direction making insulating resin layers 51a-51d interpose, a plurality of the coils 52a', 52b' are so laminated that a coil 52b of the next layer is accommodated in a recessed part of the unevenness generated in the insulating resin layer 51b covering the coil 52a'.
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