| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method, which can readily remove burrs formed on the surface of the metal plated layer of a lead frame, to which a metal ball is attached in the formation of the semiconductor device having a BGA structure, and the manufacturing apparatus using the method thereof. SOLUTION: A second gate 106a and a dummy cavity 107a are provided on the a protrusion 105a provided in a cavity 104a of a cavity block 101a. When resin sealing is made using this cavity block 101a, the dummy cavity which is readily removed is formed on the surface of a metal plated layer.</p> |
