CERAMIC WIRING SUBSTRATE AND PACKAGE STRUCTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide high reliable ceramic wiring substrate capable of sustaining firmly and stably connected state when a wiring substrate assuming a glass ceramics as an insulating substrate is packaged on an outer circuit substrate whereon a wiring layer is coat-formed on the surface of the insulating substrate containing organic resin by brazing process and the package structure thereof. SOLUTION: In the package structure of a ceramic wiring substrate wherein a ceramic wiring substrate A provided with an insulating substrate 1 made of a glass ceramics, a wiring circuit layer 4 made of a low resistant metal formed on the surface or inside the insulating substrate 1 and a plurality of connecting pads 5 formed on the bottom face of the insulating substrate 1 is electrically connected to an outer circuit substrate B wherein wiring layers 8 are coat-formed on the surface of an insulating base substrate 7 containing organic resin between the connecting pads 5 and the wiring layers using the connecting terminals 6 made of spherical wax material. The pad diameter x of the connecting pads 5 is formed to be 55-65% of the intercentral distance y. Furthermore, it is recommended that the thermal expansion difference between the insulating substrate 1 and the insulating base substrate 7 may be 1-8 ppm/ deg.C.