PRINTED WIRING BOARD AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board superior in connection property and reliability and manufacture thereof whereby it is possible to surely form a Ni plating layer at openings of a solder resist layer and raise the adhesion to an underfill at mounting. SOLUTION: Org. residues on a metal surface (roughed surface 162) in openings and oxide film layer on the surface of a solder resist layer 70 formed on a board 30 are removed by an O plasma, hence an Ni plating layer 72 can be adequately precipitated on the roughened surface 162, and the adhesion to an underfill 88 can be raised because of the raised wettability of the solder resist layer 70.