发明名称 |
HEAT RADIATING DEVICE FOR ELECTRONIC EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide excellent heat radiating performance out of a housing. SOLUTION: The heat radiating device radiates heat from a CPU 5 provided in a personal computer 1 and arranged in a housing 3 out of the housing 3. The device comprises a horizontal aluminum board 7 disposed in the housing 3 and having a heat pipe 9 provided in the housing 3. Air flow ports 20, 21 are respectively formed at right and left sidewalls 3a, 3b of the housing 3. A fan 22 for sucking the air out of the housing 3 from the port 21 of the right side and exhausting the air in the housing 3 is disposed in the housing 3. A through hole 18 is formed at a portion where the pipe 9 of the board 7 is not provided. Heat radiating fins 19 are provided at a side edge of the hole 18.
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申请公布号 |
JP2000022374(A) |
申请公布日期 |
2000.01.21 |
申请号 |
JP19980186063 |
申请日期 |
1998.07.01 |
申请人 |
SHOWA ALUM CORP |
发明人 |
OTA KEIICHIRO;FURUKAWA YUICHI |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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